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UID:4c59b25d
ORGANIZER:MAILTO:events@mikroelektronik.fraunhofer.de
DTSTART;TZID=Europe/Berlin:20261001T093000Z
DTEND;TZID=Europe/Berlin:20261001T103000Z
SUMMARY:Microelectronics for tomorrow: Applications\, innovation and the path to advanced packaging & chiplets
DESCRIPTION:Artificial Intelligence and quantum technologies are key drivers of the next wave of microelectronics innovation. New levels of performance\, integration\, and system capabilities are required andadvanced packaging and chiplet-based architectures will be increasingly critical for these applications. The APECS Pilot Line provides powerful tools and pathways for advanced packaging and heterogeneous integration to accelerate these developments and create competitive advantages. Participants learn why acting now on chiplet technologies matters\, with a focus on market readiness\, industrialization\, and strategic impact.
URL:https://first-by-fmd.de/program/2026/day2/microelectronics-tomorrow-applications-innovation-and-the-path-to-advanced-packaging-chiplets
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