BEGIN:VCALENDAR
PRODID:-//FMD//FIRST by FMD//EN
VERSION:2.0
CALSCALE:GREGORIAN
METHOD:PUBLISH
BEGIN:VEVENT
UID:e22ffc2a
ORGANIZER:MAILTO:events@mikroelektronik.fraunhofer.de
DTSTART;TZID=Europe/Berlin:20261001T130000Z
DTEND;TZID=Europe/Berlin:20261001T141500Z
SUMMARY:Advanced packaging in the AI era: Heterogeneous integration\, 2.5D/3D and beyond
DESCRIPTION:Analysis of how advanced packaging and heterogeneous integration will provide competitive advantages in the AI era. Focus on strategic decisions for product development\, time-to-market\, and value creation.
URL:https://first-by-fmd.de/program/2026/day2/advanced-packaging-in-the-ai-era-heterogeneous-integration-2-5d-3d-and-beyond
END:VEVENT
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