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ORGANIZER:MAILTO:events@mikroelektronik.fraunhofer.de
DTSTART;TZID=Europe/Berlin:20261001T133000Z
DTEND;TZID=Europe/Berlin:20261001T143000Z
SUMMARY:Dutch Innovations: Driving European Collaboration in Advanced Packaging & PIC
DESCRIPTION:Specifically in the fields of Photonic Integrated Circuits (PIC) design and manufacturing\, Advanced Packaging and Heterogeneous Integration\, the Netherlands are working on revolutionary semiconductor and PIC packaging technologies that will enable higher performance\, better testing and metrology\, greater scalability\, and economically viable manufacturing in Europe. This session highlights key initiatives\, including the ChipNL Competence Centre and the PIXEurope Pilot Line by the PITC\, alongside the latest developments in Dutch research and industry. Together\, these efforts demonstrate how collaboration across the European ecosystem is vital for accelerating innovation and strengthening Europe's position in semiconductors and integrated photonics. The session concludes with an interactive Q&amp\;A.
URL:https://first-by-fmd.de/program/2026/day2/dutch-innovations-driving-european-collaboration-in-advanced-packaging-pic
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