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    30.09. - 01.10.2026, Berlin New European conference on microelectronic trends, roadmaps and strategic alignment

    FIRST represents fast innovation through research in semiconductor technologies

    Join the leaders shaping Europe’s semiconductor future

    Semiconductors are no longer just components – they are the foundation of economic resilience, technological sovereignty, security, and sustainable growth.
    They are not optional – they are strategic.

    FIRST brings together decision-makers who define strategies, shape investments and drive innovation across Europe’s semiconductor ecosystem. If you are responsible for product strategy or technology roadmaps, this is where Europe’s semiconductor future becomes business reality.

    Build partnerships and secure your competitive edge.


    FIRST is a high-level trend forum designed for those who turn technology into industrial leadership

    Why attend FIRST 2026?

    • Connect with C-level executives and senior decision-makers from across Europe’s semiconductor ecosystem
    • Identify strategic partnerships along the full value chain
    • Accelerate innovation-to-market pathways
    • Strengthen supply chain resilience and technological independence
    • Gain early insight into emerging technology and market trends
    • Position your company at the center of Europe’s semiconductor transformation

    Key Facts

    • Date: 30.09. – 01.10. 2026
    • Format: 2-day high-level conference
    • Location: EUREF-Campus, Berlin/Germany
    • Participants: over 500 attendees expected
    • Audience: C-level executives, business unit leaders, CTOs, innovation and strategy decision-makers
    • Focus: Shaping Europe’s future with semiconductors
    • Objective: Strengthening industrial competitiveness, resilience and innovation leadership

    FIRST addresses key industries like automotive, telecommunications, AI, healthcare, industrial manufacturing and energy

    Key Topics

    • European Chips Act
    • European semiconductor strategy
    • Innovation ecosystems in Europe
    • From lab to industry
    • European microelectronics infrastructure
    • APECS pilot line
    • Semiconductor value chains
    • Applications driving microelectronics innovation
    • Skills and workforce development

    Key Technologies

    • Advanced packaging
    • Heterogeneous integration
    • Chiplet architectures
    • 2.5D / 3D integration
    • System technology co-optimization (STCO)
    • Characterization, test & reliability (CTR)
    • Quasi-monolithic integration (QMI)
    • Design infrastructure
    • Chiplet manufacturing

    Program

    Day 1
    Day 2

    30.09. | Shaping Europe’s future with semiconductors

    09:00 - 09:30
    Beginning Day 1

    Welcome coffee & registration

    Arrive, connect, and get an overview of the day. The perfect starting point to meet key stakeholders.
    Type: Networking
    Start: 09:00
    End: 09:30
    Location:
    Lobby & Base

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    09:30 - 11:00
    Grand opening & APECS Progress Showcase

    Shaping Europe’s future with semiconductors: trends, roadmaps, and strategic alignment

    Progress showcase of the APECS Pilot Line and strategic framing of Europe’s semiconductor future. Participants gain clear insights into how Europe can remain technologically resilient and seize strategic opportunities. Focus on the EU Chips Act, Germany’s High-Tech Agenda and global competitiveness.
    Type: Session
    Start: 09:30
    End: 11:00
    Location:
    Main Stage

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    11:00 - 12:15
    Opening Panel Discussion

    Resilience through innovation ecosystems in Europe: From policy goals to implementation

    Leading experts discuss how Europe’s innovation ecosystems secure value creation and strengthen technological leadership. The conversation focuses on how political visions and strategic policy goals can stimulate innovation and accelerate real-world implementation, enabling Europe to shape its technological future. Providing guidance for investments and partnership decisions, the discussion is to offer insights concerning global trends and to highlight opportunities for European companies to create market impact.
    Type: Panel discussion
    Start: 11:00
    End: 12:15
    Location:
    Main Stage

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    12:15 - 13:30
    Break & Lunch

    Networking lunch & exhibition

    Opportunities for networking with key stakeholders in industry, research, and startups. Identify strategic partnerships and explore innovation potentials.
    Type: Break & Lunch
    Start: 12:15
    End: 13:30
    Location:
    Lobby & Base

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    13:30 - 15:00
    Session 1

    Transfer to the market - from lab to industry

    Focus on accelerating market introduction of innovations and closing innovation gaps. Participants learn where the bottlenecks are and how Europe can secure technological value creation. Practical strategies for industry and policymakers.
    Type: Session
    Start: 13:30
    End: 15:00
    Location:
    Main Stage

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    15:00 - 15:45
    Break & Coffee

    Networking coffee & exhibition

    Networking over coffee with executives and potential partners. Opportunities to discuss strategic insights directly with innovators.
    Type: Networking
    Start: 15:00
    End: 15:45
    Location:
    Lobby & Base

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    15:45 - 17:00
    Session 2

    Design-Infrastructure: Enabling European companies access to advanced packaging capabilities

    Presentation of the European design infrastructure as a key enabler of efficiency and innovation. Participants learn how design capabilities will accelerate time-to-market and foster collaboration. Strategic relevance for the entire value chain.
    Type: Session
    Start: 15:45
    End: 17:00
    Location:
    Main Stage

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    17:00 - 17:30
    Break & Coffee

    Coffee break & exhibition

    Participants engage with executives and innovators at the exhibition or poster session.
    Type: Networking
    Start: 17:00
    End: 17:30
    Location:
    Lobby & Base

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    17:30 - 18:30
    Panel Discussion

    Europe's edge in microelectronics: From pilot lines to production – the vision Europe 2035

    Discussion on technological resilience, strategic partnerships, and production capabilities. Participants learn about the 2035 targets of the five pilot lines and their roles in shaping Europe’s future innovation and production landscape. The subsequent discussion will address technological resilience, strategic partnerships, and production capabilities, highlighting concrete action options for industry and policy-makers with a focus on competitive advantages and critical dependencies.
    Type: Panel discussion
    Start: 17:30
    End: 18:30
    Location:
    Main Stage

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    18:30 - 22:00
    Technology Showcase & Get-Together

    Networking Evening, exhibition & poster session

    Expert pitches on technological demonstrators and poster presentations highlighting the latest developments from the APECS pilot line. Opportunity for strategic exchange, collaboration and new partnerships.
    Type: Technology showcase & get-together
    Start: 18:30
    End: 22:00
    Location:
    Lobby & Base

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    01.10. | APECS pilot line – European chiplet innovation

    09:00 - 09:30
    Beginning Day 2

    Welcome coffee & exhibition

    Arrive, connect, and get an overview of the day.
    Type: Networking
    Start: 09:00
    End: 09:30
    Location:
    Lobby & Base

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    10:30 - 12:00
    Session 4

    APECS pilot line: European chiplet innovation

    The APECS Pilot Line demonstrates how advanced packaging and heterogeneous integration will provide competitive advantages. Participants learn why and how to act now on chiplet technologies. Focus on market readiness, industrialization, and strategic impact.
    Type: Session
    Start: 10:30
    End: 12:00
    Location:
    Main Stage

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    12:00 - 13:00
    Networking & Lunch

    Networking lunch, exhibition & poster session presenting research and technology insights

    Lunch and networking at the poster session – an ideal opportunity to explore emerging technologies and find new strategic partners.
    Type: Break & Lunch
    Start: 12:00
    End: 13:00
    Location:
    Lobby & Base

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    13:00 - 14:15
    Session 5

    Advanced packaging in the AI era: Heterogeneous integration, 2.5D/3D and beyond

    Analysis of how advanced packaging and heterogeneous integration will provide competitive advantages in the AI era. Focus on strategic decisions for product development, time-to-market, and value creation.
    Type: Session
    Start: 13:00
    End: 14:15
    Location:
    Main Stage

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    Strategic Spotlight 1

    Chiplet manufacturing as a supply chain: Roles, dependencies and bottlenecks

    Overview of critical supply chain aspects in chiplet manufacturing. Participants gain guidance on roles, dependencies, and bottlenecks for strategic planning.
    Type: Strategic spotlight
    Start: 13:00
    End: 14:15
    Location:
    Club I

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    Strategic Spotlight 2

    Design infrastructure in Europe: What startups, SMEs, and research really need

    Presentation on how design capabilities and infrastructure will secure Europe’s competitiveness. Participants learn to identify opportunities and potential collaborations with startups and SMEs.
    Type: Strategic spotlight
    Start: 13:00
    End: 14:15
    Location:
    Club II

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    14:15 - 14:45
    Break & Coffee

    Networking coffee & exhibition

    Time for exchange and informal discussions alongside the exhibition.
    Type: Networking
    Start: 14:15
    End: 14:45
    Location:
    Lobby & Base

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    14:45 - 16:00
    Closing Panel Discussion

    Beyond technology: Talent, skills, and sustainable workforce models for semiconductor excellence

    Strategic discussion on talent, skills, and sustainable workforce models for European semiconductor excellence.
    Type: Panel discussion
    Start: 14:45
    End: 16:00
    Location:
    Main Stage

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    Innovation Deep Dive 1

    Quasimonolithic integration: The ultimate device integration concept

    Showcase of cutting-edge device integration technologies. Participants gain insights into disruptive product potential and strategic roadmaps.
    Type: Deep dive
    Start: 14:45
    End: 16:00
    Location:
    Club I

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    Innovation Deep Dive 2

    STCO: Accelerating innovation from chiplet design to scalable production in Europe

    Practical insights on how to scale chiplet design into European production. Focus on faster time-to-market and strategies to gain competitive advantages.
    Type: Deep dive
    Start: 14:45
    End: 16:00
    Location:
    Club II

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    Registration

    Book your ticket and join the leaders of Europe’s microelectronic ecosystem

    Program committee

    Scientific leadership driving Europe’s semiconductor agenda

    Location

    Berlin is where strategy meets action. As Germany’s capital, it sits at the intersection of policy, industry and international cooperation. Decisions that shape Europe’s technology sovereignty and industrial resilience are framed here.

    Accessible, international and forward-looking — Berlin provides the ideal setting to drive meaningful partnerships and accelerate Europe’s semiconductor ambitions.

    Hosting FIRST in Berlin places semiconductor leaders at the heart of Europe’s strategic dialogue — where market dynamics, regulatory frameworks and industrial ambitions converge.

    EUREF-Campus Gasometer
    EUREF-Campus 17
    10829 Berlin

    Newsletter

    Register now for FIRST.insights!

    Contact



      Frequently asked questions

      About FIRST and Europe’s semiconductor strategy

      What is the European semiconductor strategy conference FIRST?

      FIRST is a high-level European conference focused on semiconductor strategy, technology roadmaps and industrial innovation in microelectronics. The event brings together leaders from industry, research and policy to discuss the future of Europe’s semiconductor ecosystem, including initiatives such as the EU Chips Act, advanced packaging, chiplet technologies and pilot lines. By connecting technological developments with industrial strategy, FIRST serves as a platform for strategic alignment across Europe’s semiconductor value chain.

      How does FIRST relate to the EU Chips Act and Germany’s High-Tech Agenda?

      FIRST provides a strategic forum to discuss the implementation of the EU Chips Act and its impact on the European semiconductor ecosystem. The conference brings together decision-makers from industry, research and policy to explore how initiatives such as European pilot lines, advanced packaging and design infrastructure can strengthen technological sovereignty and supply-chain resilience.

      By connecting technology roadmaps with industrial strategy, FIRST supports the dialogue needed to translate the EU Chips Act into concrete innovation and investment pathways. The conference also reflects Germany’s High-Tech Agenda, which aims to strengthen innovation capacity and industrial competitiveness in key technologies such as microelectronics.

      Who should attend Europe’s semiconductor strategy conference?

      FIRST brings together decision-makers from industry, research and policy shaping the European semiconductor industry. The conference offers strategic orientation on technology trends, semiconductor roadmaps and innovation priorities in microelectronics.

      Industry leaders gain early insight into emerging technologies and faster pathways from research to market, while policymakers and research leaders discuss funding strategies, skills and innovation frameworks for Europe’s semiconductor ecosystem.

      What role do pilot lines play in Europe’s semiconductor ecosystem?

      Pilot lines are specialized semiconductor facilities that validate new technologies and manufacturing processes before large-scale industrial production. Within the EU Chips Act, they bridge the gap between research and industrial deployment by enabling prototyping, technology transfer and collaboration across the semiconductor value chain.

      The APECS pilot line, implemented through the Research Fab Microelectronics Germany (FMD) together with European partners, supports innovation in advanced packaging and heterogeneous integration while strengthening Europe’s technological resilience and global competitiveness in the semiconductor industry.

      What is the APECS pilot line?

      The APECS pilot line (Advanced Packaging and Integration for Electronic Components and Systems) is a European semiconductor pilot line established under the EU Chips Act. Coordinated by the Fraunhofer-Gesellschaft and implemented by the Research Fab Microelectronics Germany (FMD), APECS provides companies and research organizations with access to advanced packaging, heterogeneous integration and chiplet technologies.

      By enabling design, prototyping and pilot production, the pilot line helps transfer semiconductor innovations from research to industrial manufacturing and strengthens the European semiconductor ecosystem.

      Event information and participation

      Who is the organizer of the event?

      FIRST is organized by the Research Fab Microelectronics Germany, FMD for its German acronym. FMD is a cross-location and cross-technology collaboration between 13 Fraunhofer Institutes and 2 Leibniz Institutes in micro- and nanoelectronics. The idea behind it: a one-stop shop for a customized range of services combining the individual expertise of R&D institutes collaborating across Germany. As a pioneer in cross-location and cross-technology collaboration, FMD actively addresses current and future challenges in electronics research, thereby ensuring that Germany and Europe maintain and expand their technological resilience.

      The organizer of the event is:

      Research Fab Microelectronics Germany (FMD) / Fraunhofer Group for Microelectronics
      Anna-Louisa-Karsch-Straße 2
      10178 Berlin
      Germany

      How is the program committee composed?

      The FIRST Program Committee is composed of leading institute directors of the Research Fab Microelectronics Germany (FMD). Bringing together outstanding scientific excellence, technological leadership and decades of experience in industrial collaboration, the committee ensures a program that is strategically relevant, technologically cutting-edge and industry-driven.

      Where will the event take place?

      The event will take place in the Gasometer at the EUREF-Campus in Berlin, a leading hub for innovation, energy and technology. The campus is conveniently accessible via Berlin Südkreuz station as well as BER Airport, ensuring efficient travel connections for international and national participants.

       

      EUREF-Campus Gasometer
      EUREF-Campus 17
      10829 Berlin

      Getting there:

      • By train: Berlin Südkreuz is one of the city’s major railway hubs with high-speed (ICE) and regional connections. The EUREF-Campus can be reached from there within a short distance by public transport or taxi.
      • By air: Berlin Brandenburg Airport (BER) is approximately 20–25 minutes away by taxi or public transport.
      • By public transport: The campus is well connected via S-Bahn and bus services, with nearby stations including S Südkreuz and S Schöneberg.
      • By car: On-site parking is available. We recommend allowing extra time for traffic in Berlin.

      What is the registration process?

      Registration takes place online via a corresponding registration form. After successful registration, you will receive a confirmation by e-mail which will include your purchased tickets in digital form.

      The organizers cannot guarantee ticket availability on-site. Prior registration is strongly advised.

      What are the prices for the event?

      The early bird rate for the conference ticket is 299 € for both days. Standard rate for the conference ticket is 449 € for both days. There are no tickets for one conference day only.

      Early bird rates apply until the 22nd of June 2026; afterwards, standard rates apply.

      Student rate conference tickets are limited and cost 49 € for both days. The early bird deadline does not apply to student tickets.

      How can students get a reduced participation fee?

      Students must provide valid enrollment information during registration to receive student ticket rates and must present an active student ID together with their student ticket code at the conference check-in.

      Student rates apply to conference tickets only.

      Do I need a separate ticket for each conference day?

      No, when purchasing the conference ticket, you are automatically granted access to both conference days, including the get-together evening on Day 1.

      If you wish to participate only on one of the conference days, you still need to book a regular ticket.

      What are the acceptable payment methods?

      Payments can be made by credit card or bank transfer. You will receive a digital invoice per email upon registration.

      Cash payments are not permitted on-site. If you plan to add registration items during the conference, please bring a credit card.

      Can I cancel my ticket or transfer it to another person?

      Cancellations must be submitted in writing to:

      For cancellations up to four months before the start event, 90% of the participation fees will be refunded. For cancellations up to two months before the start event, 50% of the participation fees will be refunded. For cancellations less than two months before the start of the event, the financial obligations remain in full.

      For further details, please refer to the general terms and conditions.

      Registrations may be transferred to another person from the same organization free of charge by sending a written request to . Name change requests will be accepted until the 25th of September 2026.

      Will vegetarian and vegan catering options be provided?

      The catering during the event is completely meatless; vegetarian and vegan options only will be provided. Further information regarding allergy specifications can be found directly at the buffet.

      Who do I contact in case of questions?

      If you have any questions regarding the event, please contact our organizing team at

      Put innovation FIRST. Shape the momentum.

      Join FIRST and connect with the innovators & leaders

      register now

      Imprint

      Fraunhofer Group for Microelectronics
      Anna-Louisa-Karsch-Str. 2
      10178 Berlin
      Germany

      Phone  +49 30 4005591-44
      E-Mail
      Internet www.mikroelektronik.fraunhofer.de

      is a constituent entity of the Fraunhofer-Gesellschaft, and as such has no separate legal status.

      Fraunhofer-Gesellschaft
      zur Förderung der angewandten Forschung e.V.
      Hansastraße 27 c
      80686 München
      Germany

      Phone +49 89 1205- 0
      E-Mail
      Internet www.fraunhofer.de

      Responsible editor:
      Romy Zschiedrich

      VAT Identification Number
      in accordance with §27 a VAT Tax Act: DE 129515865

      Court of jurisdiction
      Amtsgericht München (district court)
      Registered nonprofit association
      Registration no. VR 4461

      General terms and conditions

      Here you can download the general terms and conditions of events of Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V applying to FIRST by FMD

      Terms & Conditions
      5months
      2weeks
      1day
      10hours

      EUREF-CAMPUS BERLIN | GASOMETER

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