30.09. - 01.10.2026, Berlin New European conference on microelectronic trends, roadmaps and strategic alignment
FIRST represents fast innovation through research in semiconductor technologies
Join the leaders shaping Europe’s semiconductor future
Semiconductors are no longer just components – they are the foundation of economic resilience, technological sovereignty, security, and sustainable growth.
They are not optional – they are strategic.
FIRST brings together decision-makers who define strategies, shape investments and drive innovation across Europe’s semiconductor ecosystem. If you are responsible for product strategy or technology roadmaps, this is where Europe’s semiconductor future becomes business reality.
Build partnerships and secure your competitive edge.
FIRST is a high-level trend forum designed for those who turn technology into industrial leadership
Why attend FIRST 2026?
- Connect with C-level executives and senior decision-makers from across Europe’s semiconductor ecosystem
- Identify strategic partnerships along the full value chain
- Accelerate innovation-to-market pathways
- Strengthen supply chain resilience and technological independence
- Gain early insight into emerging technology and market trends
- Position your company at the center of Europe’s semiconductor transformation
Key Facts
- Date: 30.09. – 01.10. 2026
- Format: 2-day high-level conference
- Location: EUREF-Campus, Berlin/Germany
- Participants: over 500 attendees expected
- Audience: C-level executives, business unit leaders, CTOs, innovation and strategy decision-makers
- Focus: Shaping Europe’s future with semiconductors
- Objective: Strengthening industrial competitiveness, resilience and innovation leadership
FIRST addresses key industries like automotive, telecommunications, AI, healthcare, industrial manufacturing and energy
Key Topics
- European Chips Act
- European semiconductor strategy
- Innovation ecosystems in Europe
- From lab to industry
- European microelectronics infrastructure
- APECS pilot line
- Semiconductor value chains
- Applications driving microelectronics innovation
- Skills and workforce development
Key Technologies
- Advanced packaging
- Heterogeneous integration
- Chiplet architectures
- 2.5D / 3D integration
- System technology co-optimization (STCO)
- Characterization, test & reliability (CTR)
- Quasi-monolithic integration (QMI)
- Design infrastructure
- Chiplet manufacturing
Program
30.09. | Shaping Europe’s future with semiconductors
Welcome coffee & registration
| Type: | Networking |
| Start: | 09:00 |
| End: | 09:30 |
| Location: |
Lobby & Base
|
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Shaping Europe’s future with semiconductors: trends, roadmaps, and strategic alignment
| Type: | Session |
| Start: | 09:30 |
| End: | 11:00 |
| Location: |
Main Stage
|
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Resilience through innovation ecosystems in Europe: From policy goals to implementation
| Type: | Panel discussion |
| Start: | 11:00 |
| End: | 12:15 |
| Location: |
Main Stage
|
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Networking lunch & exhibition
| Type: | Break & Lunch |
| Start: | 12:15 |
| End: | 13:30 |
| Location: |
Lobby & Base
|
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Transfer to the market - from lab to industry
| Type: | Session |
| Start: | 13:30 |
| End: | 15:00 |
| Location: |
Main Stage
|
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Networking coffee & exhibition
| Type: | Networking |
| Start: | 15:00 |
| End: | 15:45 |
| Location: |
Lobby & Base
|
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Design-Infrastructure: Enabling European companies access to advanced packaging capabilities
| Type: | Session |
| Start: | 15:45 |
| End: | 17:00 |
| Location: |
Main Stage
|
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Coffee break & exhibition
| Type: | Networking |
| Start: | 17:00 |
| End: | 17:30 |
| Location: |
Lobby & Base
|
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Europe's edge in microelectronics: From pilot lines to production – the vision Europe 2035
| Type: | Panel discussion |
| Start: | 17:30 |
| End: | 18:30 |
| Location: |
Main Stage
|
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Networking Evening, exhibition & poster session
| Type: | Technology showcase & get-together |
| Start: | 18:30 |
| End: | 22:00 |
| Location: |
Lobby & Base
|
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01.10. | APECS pilot line – European chiplet innovation
Welcome coffee & exhibition
| Type: | Networking |
| Start: | 09:00 |
| End: | 09:30 |
| Location: |
Lobby & Base
|
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Microelectronics for tomorrow: Applications, innovation and the path to advanced packaging & chiplets
| Type: | Session |
| Start: | 09:30 |
| End: | 10:30 |
| Location: |
Main Stage
|
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APECS pilot line: European chiplet innovation
| Type: | Session |
| Start: | 10:30 |
| End: | 12:00 |
| Location: |
Main Stage
|
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Networking lunch, exhibition & poster session presenting research and technology insights
| Type: | Break & Lunch |
| Start: | 12:00 |
| End: | 13:00 |
| Location: |
Lobby & Base
|
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Advanced packaging in the AI era: Heterogeneous integration, 2.5D/3D and beyond
| Type: | Session |
| Start: | 13:00 |
| End: | 14:15 |
| Location: |
Main Stage
|
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Chiplet manufacturing as a supply chain: Roles, dependencies and bottlenecks
| Type: | Strategic spotlight |
| Start: | 13:00 |
| End: | 14:15 |
| Location: |
Club I
|
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Design infrastructure in Europe: What startups, SMEs, and research really need
| Type: | Strategic spotlight |
| Start: | 13:00 |
| End: | 14:15 |
| Location: |
Club II
|
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Networking coffee & exhibition
| Type: | Networking |
| Start: | 14:15 |
| End: | 14:45 |
| Location: |
Lobby & Base
|
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Beyond technology: Talent, skills, and sustainable workforce models for semiconductor excellence
| Type: | Panel discussion |
| Start: | 14:45 |
| End: | 16:00 |
| Location: |
Main Stage
|
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Quasimonolithic integration: The ultimate device integration concept
| Type: | Deep dive |
| Start: | 14:45 |
| End: | 16:00 |
| Location: |
Club I
|
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STCO: Accelerating innovation from chiplet design to scalable production in Europe
| Type: | Deep dive |
| Start: | 14:45 |
| End: | 16:00 |
| Location: |
Club II
|
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Registration
Book your ticket and join the leaders of Europe’s microelectronic ecosystem
Program committee
Scientific leadership driving Europe’s semiconductor agenda
Location
Berlin is where strategy meets action. As Germany’s capital, it sits at the intersection of policy, industry and international cooperation. Decisions that shape Europe’s technology sovereignty and industrial resilience are framed here.
Accessible, international and forward-looking — Berlin provides the ideal setting to drive meaningful partnerships and accelerate Europe’s semiconductor ambitions.
Hosting FIRST in Berlin places semiconductor leaders at the heart of Europe’s strategic dialogue — where market dynamics, regulatory frameworks and industrial ambitions converge.
EUREF-Campus Gasometer
EUREF-Campus 17
10829 Berlin
Newsletter
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Contact
Frequently asked questions
About FIRST and Europe’s semiconductor strategy
What is the European semiconductor strategy conference FIRST?
FIRST is a high-level European conference focused on semiconductor strategy, technology roadmaps and industrial innovation in microelectronics. The event brings together leaders from industry, research and policy to discuss the future of Europe’s semiconductor ecosystem, including initiatives such as the EU Chips Act, advanced packaging, chiplet technologies and pilot lines. By connecting technological developments with industrial strategy, FIRST serves as a platform for strategic alignment across Europe’s semiconductor value chain.
How does FIRST relate to the EU Chips Act and Germany’s High-Tech Agenda?
FIRST provides a strategic forum to discuss the implementation of the EU Chips Act and its impact on the European semiconductor ecosystem. The conference brings together decision-makers from industry, research and policy to explore how initiatives such as European pilot lines, advanced packaging and design infrastructure can strengthen technological sovereignty and supply-chain resilience.
By connecting technology roadmaps with industrial strategy, FIRST supports the dialogue needed to translate the EU Chips Act into concrete innovation and investment pathways. The conference also reflects Germany’s High-Tech Agenda, which aims to strengthen innovation capacity and industrial competitiveness in key technologies such as microelectronics.
Who should attend Europe’s semiconductor strategy conference?
FIRST brings together decision-makers from industry, research and policy shaping the European semiconductor industry. The conference offers strategic orientation on technology trends, semiconductor roadmaps and innovation priorities in microelectronics.
Industry leaders gain early insight into emerging technologies and faster pathways from research to market, while policymakers and research leaders discuss funding strategies, skills and innovation frameworks for Europe’s semiconductor ecosystem.
What role do pilot lines play in Europe’s semiconductor ecosystem?
Pilot lines are specialized semiconductor facilities that validate new technologies and manufacturing processes before large-scale industrial production. Within the EU Chips Act, they bridge the gap between research and industrial deployment by enabling prototyping, technology transfer and collaboration across the semiconductor value chain.
The APECS pilot line, implemented through the Research Fab Microelectronics Germany (FMD) together with European partners, supports innovation in advanced packaging and heterogeneous integration while strengthening Europe’s technological resilience and global competitiveness in the semiconductor industry.
What is the APECS pilot line?
The APECS pilot line (Advanced Packaging and Integration for Electronic Components and Systems) is a European semiconductor pilot line established under the EU Chips Act. Coordinated by the Fraunhofer-Gesellschaft and implemented by the Research Fab Microelectronics Germany (FMD), APECS provides companies and research organizations with access to advanced packaging, heterogeneous integration and chiplet technologies.
By enabling design, prototyping and pilot production, the pilot line helps transfer semiconductor innovations from research to industrial manufacturing and strengthens the European semiconductor ecosystem.
Event information and participation
Who is the organizer of the event?
FIRST is organized by the Research Fab Microelectronics Germany, FMD for its German acronym. FMD is a cross-location and cross-technology collaboration between 13 Fraunhofer Institutes and 2 Leibniz Institutes in micro- and nanoelectronics. The idea behind it: a one-stop shop for a customized range of services combining the individual expertise of R&D institutes collaborating across Germany. As a pioneer in cross-location and cross-technology collaboration, FMD actively addresses current and future challenges in electronics research, thereby ensuring that Germany and Europe maintain and expand their technological resilience.
The organizer of the event is:
Research Fab Microelectronics Germany (FMD) / Fraunhofer Group for Microelectronics
Anna-Louisa-Karsch-Straße 2
10178 Berlin
Germany
How is the program committee composed?
The FIRST Program Committee is composed of leading institute directors of the Research Fab Microelectronics Germany (FMD). Bringing together outstanding scientific excellence, technological leadership and decades of experience in industrial collaboration, the committee ensures a program that is strategically relevant, technologically cutting-edge and industry-driven.
Where will the event take place?
The event will take place in the Gasometer at the EUREF-Campus in Berlin, a leading hub for innovation, energy and technology. The campus is conveniently accessible via Berlin Südkreuz station as well as BER Airport, ensuring efficient travel connections for international and national participants.
EUREF-Campus Gasometer
EUREF-Campus 17
10829 Berlin
Getting there:
- By train: Berlin Südkreuz is one of the city’s major railway hubs with high-speed (ICE) and regional connections. The EUREF-Campus can be reached from there within a short distance by public transport or taxi.
- By air: Berlin Brandenburg Airport (BER) is approximately 20–25 minutes away by taxi or public transport.
- By public transport: The campus is well connected via S-Bahn and bus services, with nearby stations including S Südkreuz and S Schöneberg.
- By car: On-site parking is available. We recommend allowing extra time for traffic in Berlin.
What is the registration process?
Registration takes place online via a corresponding registration form. After successful registration, you will receive a confirmation by e-mail which will include your purchased tickets in digital form.
The organizers cannot guarantee ticket availability on-site. Prior registration is strongly advised.
What are the prices for the event?
The early bird rate for the conference ticket is 299 € for both days. Standard rate for the conference ticket is 449 € for both days. There are no tickets for one conference day only.
Early bird rates apply until the 22nd of June 2026; afterwards, standard rates apply.
Student rate conference tickets are limited and cost 49 € for both days. The early bird deadline does not apply to student tickets.
How can students get a reduced participation fee?
Students must provide valid enrollment information during registration to receive student ticket rates and must present an active student ID together with their student ticket code at the conference check-in.
Student rates apply to conference tickets only.
Do I need a separate ticket for each conference day?
No, when purchasing the conference ticket, you are automatically granted access to both conference days, including the get-together evening on Day 1.
If you wish to participate only on one of the conference days, you still need to book a regular ticket.
What are the acceptable payment methods?
Payments can be made by credit card or bank transfer. You will receive a digital invoice per email upon registration.
Cash payments are not permitted on-site. If you plan to add registration items during the conference, please bring a credit card.
Can I cancel my ticket or transfer it to another person?
Cancellations must be submitted in writing to:
For cancellations up to four months before the start event, 90% of the participation fees will be refunded. For cancellations up to two months before the start event, 50% of the participation fees will be refunded. For cancellations less than two months before the start of the event, the financial obligations remain in full.
For further details, please refer to the general terms and conditions.
Registrations may be transferred to another person from the same organization free of charge by sending a written request to . Name change requests will be accepted until the 25th of September 2026.
Will vegetarian and vegan catering options be provided?
The catering during the event is completely meatless; vegetarian and vegan options only will be provided. Further information regarding allergy specifications can be found directly at the buffet.
Who do I contact in case of questions?
If you have any questions regarding the event, please contact our organizing team at
Put innovation FIRST. Shape the momentum.
Imprint
Fraunhofer Group for Microelectronics
Anna-Louisa-Karsch-Str. 2
10178 Berlin
Germany
Phone +49 30 4005591-44
E-Mail
Internet www.mikroelektronik.fraunhofer.de
is a constituent entity of the Fraunhofer-Gesellschaft, and as such has no separate legal status.
Fraunhofer-Gesellschaft
zur Förderung der angewandten Forschung e.V.
Hansastraße 27 c
80686 München
Germany
Phone +49 89 1205- 0
E-Mail
Internet www.fraunhofer.de
Responsible editor:
Romy Zschiedrich
VAT Identification Number
in accordance with §27 a VAT Tax Act: DE 129515865
Court of jurisdiction
Amtsgericht München (district court)
Registered nonprofit association
Registration no. VR 4461