FIRST by FMD returns in autumn 2027 | Berlin The European conference on microelectronic trends, roadmaps and strategic alignment
FIRST represents fast innovation through research in semiconductor technologies
Join the leaders shaping Europe’s semiconductor future
Semiconductors are no longer just components – they are the foundation of economic resilience, technological sovereignty, security, and sustainable growth.
They are not optional – they are strategic.
FIRST brings together decision-makers who define strategies, shape investments and drive innovation across Europe’s semiconductor ecosystem. If you are responsible for product strategy or technology roadmaps, this is where Europe’s semiconductor future becomes business reality.
Build partnerships and secure your competitive edge.
Looking back at FIRST 2026
Andreja Erbes | Director Technology Scouting and R&D Partnerships, STMicroelectronics
It was good re-connecting with so many of our partners in person.
Congrats to the FMD team for organizing it!
Gerhard Schoenthal | COO, Virginia Diodes
Very interesting to hear more about the EUs approach to the semiconductor and electronics ecosystem and the APECS Pilot Line.
Cynthia Liao | CEO & Founder, Vertical Semiconductor
The entire FMD community can be accessed through FIRST as a direct entry point into the European semiconductor ecosystem.
The event opened the door and helped us navigate a landscape that would otherwise have taken us months, maybe years, to fully understand.
Being able to navigate all of that efficiently has really allowed us to accelerate our momentum here.
Dr. Sandra Engle | Sector Group Leader Productronics, VDMA
FIRST brings together key stakeholders across the semiconductor value chain and addresses the key topics and challenges facing the European semiconductor industry.
This makes it a valuable access point for industry to connect with the ecosystem, exchange perspectives and identify opportunities for collaboration.
Dr. Thomas Rettich | Head of Scientific Coordination, TRUMPF
FIRST brings the right people together in the right place at the right time. That creates the environment for exchange, dialogue and new cooperation… I think it is absolutely necessary to have this kind of conference in Germany.
We have been waiting for something like FIRST.
Karl-Peter Fritz | Geschäftsführer, Hahn-Schickard
Besonders wertvoll waren natürlich – wie immer – die persönlichen Gespräche. Die Teilnehmerliste war hochkarätig.
FIRST is a high-level trend forum designed for those who turn technology into industrial leadership
FIRST 2026 at a glance
- Date: 30/09 – 01/10/2026
- Format: 2-day high-level semiconductor conference
- Location: EUREF-Campus, Berlin/Germany
- Participants: 500+ attendees | Sold out
- Speakers: 67 speakers from industry, research and policy
- Ecosystem: 230+ organisations represented
- Audience: C-level executives, CTOs, industry leaders, R&D and strategy decision-makers
- Focus: Semiconductor innovation, European competitiveness and industrial resilience
Why attend FIRST 2027?
- Connect with C-level executives and senior decision-makers from across Europe’s semiconductor ecosystem
- Identify strategic partnerships along the full value chain
- Accelerate innovation-to-market pathways
- Strengthen supply chain resilience and technological independence
- Gain early insight into emerging technology and market trends
- Position your company at the center of Europe’s semiconductor transformation
FIRST addresses key industries like automotive, telecommunications, AI, healthcare, industrial manufacturing and energy
Key Topics
- European Chips Act
- European semiconductor strategy
- Innovation ecosystems in Europe
- From lab to industry
- European microelectronics infrastructure
- APECS pilot line
- Semiconductor value chains
- Applications driving microelectronics innovation
- Skills and workforce development
Key Technologies
- Advanced packaging
- Heterogeneous integration
- Chiplet architectures
- 2.5D / 3D integration
- System technology co-optimization (STCO)
- Characterization, test & reliability (CTR)
- Quasi-monolithic integration (QMI)
- Design infrastructure
- Chiplet manufacturing
APECS at FIRST
Advancing European Chiplet Innovation
Launched within the framework of APECS, FIRST by FMD connects Europe’s semiconductor ecosystem.
Discover how the European APECS Pilot Line advances chiplet innovation, advanced packaging and heterogeneous integration.
Newsletter
Be here to hear first about FIRST 2027
Location
Berlin is where strategy meets action. As Germany’s capital, it sits at the intersection of policy, industry and international cooperation. Decisions that shape Europe’s technology sovereignty and industrial resilience are framed here.
Accessible, international and forward-looking — Berlin provides the ideal setting to drive meaningful partnerships and accelerate Europe’s semiconductor ambitions.
Hosting FIRST in Berlin places semiconductor leaders at the heart of Europe’s strategic dialogue — where market dynamics, regulatory frameworks and industrial ambitions converge.
Contact
FIRST26 | Top speakers
Europe’s leading voices in technology and industrial strategy
- Rolf Aschenbrenner
Deputy Institute Director, Fraunhofer IZM - Klaus Beilenhoff
Strategy and Innovation, United Monolithic Semiconductors GmbH - Engelbert Beyer
Head of Division, Federal Ministry of Research, Technology and Space (BMFTR) - Frank Bösenberg
CEO, Silicon Saxony - Ondrej Burkacky
Managing Director Semiconductor, MGX - Jens Eisert
Professor for Quantum Physics, Freie Universität Berlin - Josef Ernst
CEO, ASMPT SMT Solutions / VDMA - Christian Frank
CEO, SIKORA - Eric Fribourg-Blanc
Senior Programme Officer, Chips JU - Matthias Gläßer
Vice President Global Operations, JENOPTIK - Harald Gossner
Senior Principal Engineer, Intel - Kilian Groß
Director, Enabling and Emerging Technologies, DG CONNECT, European Commission - Fabio Gualandris
President Quality Manufacturing & Technology, STMicroelectronics
- Nikolaus Hahne
CEO Business and Operations, Quantune - Regis Hamelin
Project Lead aCCCess, Bluemorpho - Holger Hanselka
President, Fraunhofer-Gesellschaft - Thomas Heurung
CEO Siemens Electronic Design Automation GmbH& Technical Director EMEA, Siemens EDA - Romano Hoofman
Coordinator, EuroCDP - Manfred Horstmann
General Manager and Senior Vice President, GlobalFoundries - Michael Hosemann
Technical Project Lead Detector ASICs, Siemens Healthineers - Jari Kinaret
Executive Director, Chips Joint Undertaking (Chips JU)
- Katharina Kunze
Managing Director, Microtec Academy - Nicolai Künzner
Managing Director and Divisional Board Member, Diehl Defence GmbH - Lars Lust
Senior Director Embedded IoT Solutions, Swissbit - Patricie Merkert
Institute Director, Fraunhofer IAF - Axel Müller-Groeling
Member of the Executive Board for Infrastructure and Digitalization, Fraunhofer-Gesellschaft - Pascal Oberndorff
Director Package Innovation, NTI Automotive Packaging, NXP Semiconductors - Benjamin Prautsch
Group Manager Advanced Mixed-Signal Automation, Fraunhofer IIS-EAS - Carlo Reita
CEO, ChipsIT - Carsten Salewski
Member of the Executive Board, Viscom SE and Chairman of the Productronics Division, VDMA - Michel Sarlotte
HW Technology Expert, Electronic Solutions and Electronic Packaging & Interconnect, Thales Communications & Security - Marcel Schäfer
Head of Laser Application Center, TRUMPF - Patrick Schuh
Senior Expert Active Antenna Frontends, HENSOLDT - Dirk Schumann
Head of APECS, Research Fab Microelectronics Germany - Thomas Skordas
Deputy Director-General DG CONNECT, EU Commission - Alexander Stanitzki
Project Lead G3C, Research Fab Microelectronics Germany - Hannes Voraberger
Vice President Corporate R&D, AT&S - Wolfgang Weber
CEO, ZVEI - Andreas Werner
Executive Vice President Corporate R&D, Rohde & Schwarz - Bernhard Wicht
Professor at the Institute of Microelectronic Systems, Leibniz University Hannover
FIRST26 | Program
30/09 | Shaping Europe’s future with semiconductors
Welcome coffee & registration
| Type: | Networking |
| Start: | 09:00 |
| End: | 09:30 |
| Location: |
Lobby & Base
|
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Shaping Europe’s future with semiconductors: trends, roadmaps, and strategic alignment
| Type: | Session |
| Start: | 09:30 |
| End: | 11:00 |
| Location: |
Main Stage
|
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Resilience through innovation ecosystems in Europe: From policy goals to implementation
| Type: | Panel discussion |
| Start: | 11:00 |
| End: | 12:15 |
| Location: |
Main Stage
|
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Networking lunch & exhibition
| Type: | Break & Lunch |
| Start: | 12:15 |
| End: | 13:30 |
| Location: |
Lobby & Base
|
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Transfer to the market - from lab to industry
| Type: | Session |
| Start: | 13:30 |
| End: | 15:00 |
| Location: |
Main Stage
|
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Networking coffee & exhibition
| Type: | Networking |
| Start: | 15:00 |
| End: | 15:45 |
| Location: |
Lobby & Base
|
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Design-Infrastructure: Enabling European companies access to advanced packaging capabilities
| Type: | Session |
| Start: | 15:45 |
| End: | 17:00 |
| Location: |
Main Stage
|
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Shaping Europe's SiP Ecosystem – Outcomes of a Pilot Study and Future Road-Mapping – Talk and Dialogue Format
| Type: | Workshop |
| Start: | 15:45 |
| End: | 17:00 |
| Location: |
Club III
|
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Coffee break & exhibition
| Type: | Networking |
| Start: | 17:00 |
| End: | 17:30 |
| Location: |
Lobby & Base
|
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Europe's edge in microelectronics: From pilot lines to production – the vision Europe 2035
| Type: | Panel discussion |
| Start: | 17:30 |
| End: | 18:30 |
| Location: |
Main Stage
|
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Networking evening, exhibition & poster session
| Type: | Technology showcase & get-together |
| Start: | 18:30 |
| End: | 22:00 |
| Location: |
Lobby & Base
|
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01/10 | APECS pilot line – European chiplet innovation
Welcome coffee & exhibition
| Type: | Networking |
| Start: | 09:00 |
| End: | 09:30 |
| Location: |
Lobby & Base
|
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Microelectronics for tomorrow: Applications, innovation and the path to advanced packaging & chiplets
| Type: | Session |
| Start: | 09:30 |
| End: | 10:30 |
| Location: |
Main Stage
|
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APECS pilot line: European chiplet innovation
| Type: | Session |
| Start: | 10:30 |
| End: | 12:00 |
| Location: |
Main Stage
|
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Networking lunch, exhibition & poster session presenting research and technology insights
| Type: | Break & Lunch |
| Start: | 12:00 |
| End: | 13:30 |
| Location: |
Lobby & Base
|
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Advanced packaging in the AI era: Heterogeneous integration, 2.5D/3D and beyond
| Type: | Session |
| Start: | 13:30 |
| End: | 14:30 |
| Location: |
Main Stage
|
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From Chips to Security: Microelectronics as a Strategic Defence Capability
| Type: | Strategic spotlight |
| Start: | 13:30 |
| End: | 14:30 |
| Location: |
Club I
|
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Design infrastructure in Europe: What startups, SMEs, and research really need
| Type: | Strategic spotlight |
| Start: | 13:30 |
| End: | 14:30 |
| Location: |
Club II
|
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Dutch Innovations: Driving European Collaboration in Advanced Packaging & PIC
| Type: | Workshop |
| Start: | 13:30 |
| End: | 14:30 |
| Location: |
Club III
|
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Networking coffee & exhibition
| Type: | Networking |
| Start: | 14:30 |
| End: | 15:00 |
| Location: |
Lobby & Base
|
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Beyond technology: Talent, skills, and sustainable workforce models for semiconductor excellence
| Type: | Panel discussion |
| Start: | 15:00 |
| End: | 16:00 |
| Location: |
Main Stage
|
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Quasimonolithic integration: The ultimate device integration concept
| Type: | Deep dive |
| Start: | 15:00 |
| End: | 16:00 |
| Location: |
Club I
|
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STCO: Accelerating innovation from chiplet design to scalable production in Europe
| Type: | Deep dive |
| Start: | 15:00 |
| End: | 16:00 |
| Location: |
Club II
|
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APECS Cleanroom Managers Workshop [invitation only]
| Type: | Workshop |
| Start: | 15:00 |
| End: | 16:30 |
| Location: |
Club III
|
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Frequently asked questions
About FIRST and Europe’s semiconductor strategy
What is the European semiconductor strategy conference FIRST?
FIRST is a high-level European conference focused on semiconductor strategy, technology roadmaps and industrial innovation in microelectronics. The event brings together leaders from industry, research and policy to discuss the future of Europe’s semiconductor ecosystem, including initiatives such as the EU Chips Act, advanced packaging, chiplet technologies and pilot lines. By connecting technological developments with industrial strategy, FIRST serves as a platform for strategic alignment across Europe’s semiconductor value chain.
FIRST is implemented within APECS, which is co-funded by the Chips Joint Undertaking and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, and Spain under the Chips for Europe Initiative.
What is APECS?
The APECS pilot line (Advanced Packaging and Integration for Electronic Components and Systems) is a European semiconductor pilot line established under the EU Chips Act. Coordinated by the Fraunhofer-Gesellschaft and implemented by the Research Fab Microelectronics Germany (FMD), APECS provides companies and research organizations with access to advanced packaging, heterogeneous integration and chiplet technologies.
By enabling design, prototyping and pilot production, the pilot line helps transfer semiconductor innovations from research to industrial manufacturing and strengthens the European semiconductor ecosystem.
APECS is co-funded by the Chips Joint Undertaking and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the Chips for Europe Initiative.
Thanks to substantial funding from the German Federal Ministry of Research, Technology and Space (BMFTR) and the federal states of Saxony, Berlin, Bavaria, Schleswig-Holstein, Baden-Württemberg, North Rhine-Westphalia, Brandenburg, and Saxony-Anhalt, it will be possible to further expand the R&D infrastructure in the coming years within the framework of the APECS pilot line.
How does FIRST relate to the EU Chips Act and Germany’s High-Tech Agenda?
FIRST provides a strategic forum to discuss the implementation of the EU Chips Act and its impact on the European semiconductor ecosystem. The conference brings together decision-makers from industry, research and policy to explore how initiatives such as European pilot lines, advanced packaging and design infrastructure can strengthen technological sovereignty and supply-chain resilience.
By connecting technology roadmaps with industrial strategy, FIRST supports the dialogue needed to translate the EU Chips Act into concrete innovation and investment pathways. The conference also reflects Germany’s High-Tech Agenda, which aims to strengthen innovation capacity and industrial competitiveness in key technologies such as microelectronics.
Who should attend Europe’s semiconductor strategy conference?
FIRST brings together decision-makers from industry, research and policy shaping the European semiconductor industry. The conference offers strategic orientation on technology trends, semiconductor roadmaps and innovation priorities in microelectronics.
Industry leaders gain early insight into emerging technologies and faster pathways from research to market, while policymakers and research leaders discuss funding strategies, skills and innovation frameworks for Europe’s semiconductor ecosystem.
What role do pilot lines play in Europe’s semiconductor ecosystem?
Pilot lines are specialized semiconductor facilities that validate new technologies and manufacturing processes before large-scale industrial production. Within the EU Chips Act, they bridge the gap between research and industrial deployment by enabling prototyping, technology transfer and collaboration across the semiconductor value chain.
The APECS pilot line, implemented through the Research Fab Microelectronics Germany (FMD) together with European partners, supports innovation in advanced packaging and heterogeneous integration while strengthening Europe’s technological resilience and global competitiveness in the semiconductor industry.
Press & Media
fmdfirstEdit ProfileWhere can I find press releases about FIRST by FMD?
Current press releases about FIRST by FMD, the conference programme and key developments are available in the FMD newsroom.
FIRST by FMD | Von der Pilotlinie zur industriellen Umsetzung | 15.09.2026
FIRST by FMD | Neues Halbleiter-Trendforum für die Zukunft Europas | 23.06.2026
English Version:
Press Contact:
FIRST.press-kit:
https://www.apecs.eu/content/dam/apecs/mediakit/press-kit/press-kit-first.zip
FIRST.press-images:
https://first-by-fmd.de/download/Press_Images_FIRSTbyFMD_2026.zip
How can journalists get accredited for FIRST by FMD?
Journalists and media representatives can request complimentary press accreditation for FIRST by FMD. Please contact our communications team at stating your name, media outlet and contact details.
Following confirmation, you will receive a complimentary press ticket granting access to the conference.
Imprint
Fraunhofer Group for Microelectronics
Anna-Louisa-Karsch-Str. 2
10178 Berlin
Germany
Phone +49 30 4005591-44
E-Mail
Internet www.mikroelektronik.fraunhofer.de
is a constituent entity of the Fraunhofer-Gesellschaft, and as such has no separate legal status.
Fraunhofer-Gesellschaft
zur Förderung der angewandten Forschung e.V.
Hansastraße 27 c
80686 München
Germany
Phone +49 89 1205- 0
E-Mail
Internet www.fraunhofer.de
Responsible editor:
Romy Zschiedrich
VAT Identification Number
in accordance with §27 a VAT Tax Act: DE 129515865
Court of jurisdiction
Amtsgericht München (district court)
Registered nonprofit association
Registration no. VR 4461
Funding:
FIRST is implemented within APECS, which is co-funded by the Chips Joint Undertaking and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, and Spain under the Chips for Europe Initiative..
Thanks to substantial funding from the German Federal Ministry of Research, Technology and Space (BMFTR) and the federal states of Saxony, Berlin, Bavaria, Schleswig-Holstein, Baden-Württemberg, North Rhine-Westphalia, Brandenburg, and Saxony-Anhalt, it will be possible to further expand the R&D infrastructure in the coming years within the framework of the APECS pilot line.
