Your eventlist @ FIRST by FMD

30.09. | Day 1: Shaping Europe’s future with semiconductors

01.10. | Day 2: APECS pilot line – European chiplet innovation

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Day 1
Day 2

30/09 | Shaping Europe’s future with semiconductors

09:00 - 09:30
Beginning Day 1

Welcome coffee & registration

Arrive, connect, and get an overview of the day. The perfect starting point to meet key stakeholders.
Type: Networking
Start: 09:00
End: 09:30
Location:
Lobby & Base

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12:15 - 13:30
Break & Lunch

Networking lunch & exhibition

Opportunities for networking with key stakeholders in industry, research, and startups. Identify strategic partnerships and explore innovation potentials.
Type: Break & Lunch
Start: 12:15
End: 13:30
Location:
Lobby & Base

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13:30 - 15:00
Session 1

Transfer to the market - from lab to industry

Focus on accelerating market introduction of innovations and closing innovation gaps. Participants learn where the bottlenecks are and how Europe can secure technological value creation. Practical strategies for industry and policymakers.
Type: Session
Start: 13:30
End: 15:00
Location:
Main Stage

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15:00 - 15:45
Break & Coffee

Networking coffee & exhibition

Networking over coffee with executives and potential partners. Opportunities to discuss strategic insights directly with innovators.
Type: Networking
Start: 15:00
End: 15:45
Location:
Lobby & Base

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15:45 - 17:00
Session 2

Design-Infrastructure: Enabling European companies access to advanced packaging capabilities

Presentation of the European design infrastructure as a key enabler of efficiency and innovation. Participants learn how design capabilities will accelerate time-to-market and foster collaboration. Strategic relevance for the entire value chain.
Type: Session
Start: 15:45
End: 17:00
Location:
Main Stage

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VDI/VDE-IT on behalf of BMFTR

Shaping Europe's SiP Ecosystem – Outcomes of a Pilot Study and Future Road-Mapping – Talk and Dialogue Format

The BMFTR-funded "Tech for Trust" (T4T) project has successfully created a distributed development and manufacturing chain for innovative System-in-Package (SiP) products in Germany, bringing together companies and research institutes to demonstrate a collaborative ecosystem that enables cutting-edge SiP production on national soil. In this conference session the consortium will present the experiences gained from building this chain and lead into an interactive World Café in which participants discuss the requirements that German and European companies have for a robust SiP infrastructure, as well as the ways in which industry can integrate into, expand, and enrich the existing value-creation network. The workshop is designed particularly for industry stakeholders, whose perspectives and requirements are key inputs to the discussion. The dialogue is intended to feed real-world insights and new ideas into the road-mapping process of the High-Tech Agenda Germany (HTAD), providing fresh impulses for research, innovation, and future policy development. The exchange will continue during the subsequent poster session. This session is particularly relevant for industry leaders, but also for policy makers and anyone interested in advancing SiP technology in Europe.
Type: Workshop
Start: 15:45
End: 17:00
Location:
Club III

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17:00 - 17:30
Break & Coffee

Coffee break & exhibition

Participants engage with executives and innovators at the exhibition or poster session.
Type: Networking
Start: 17:00
End: 17:30
Location:
Lobby & Base

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18:30 - 22:00
Technology Showcase & Get-Together

Networking evening, exhibition & poster session

Expert pitches on technological demonstrators and poster presentations highlighting the latest developments from the APECS pilot line. Opportunity for strategic exchange, collaboration and new partnerships.
Type: Technology showcase & get-together
Start: 18:30
End: 22:00
Location:
Lobby & Base

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01/10 | APECS pilot line – European chiplet innovation

09:00 - 09:30
Beginning Day 2

Welcome coffee & exhibition

Arrive, connect, and get an overview of the day.
Type: Networking
Start: 09:00
End: 09:30
Location:
Lobby & Base

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10:30 - 12:00
Session 4

APECS pilot line: European chiplet innovation

The APECS Pilot Line demonstrates how advanced packaging and heterogeneous integration will provide competitive advantages. Participants learn why and how to act now on chiplet technologies. Focus on market readiness, industrialization, and strategic impact.
Type: Session
Start: 10:30
End: 12:00
Location:
Main Stage

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12:00 - 13:30
Networking & Lunch

Networking lunch, exhibition & poster session presenting research and technology insights

Lunch and networking at the poster session – an ideal opportunity to explore emerging technologies and find new strategic partners.
Type: Break & Lunch
Start: 12:00
End: 13:30
Location:
Lobby & Base

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13:30 - 14:30
Session 5

Advanced packaging in the AI era: Heterogeneous integration, 2.5D/3D and beyond

Analysis of how advanced packaging and heterogeneous integration will provide competitive advantages in the AI era. Focus on strategic decisions for product development, time-to-market, and value creation.
Type: Session
Start: 13:30
End: 14:30
Location:
Main Stage

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Strategic Spotlight 1

From Chips to Security: Microelectronics as a Strategic Defence Capability

Microelectronics has become a strategic asset underpinning defence readiness, secure communications and critical security infrastructures. Industry leaders will discuss how Europe can secure access to trusted semiconductor technologies while reducing dependencies in an increasingly complex geopolitical environment.
Type: Strategic spotlight
Start: 13:30
End: 14:30
Location:
Club I

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Strategic Spotlight 2

Design infrastructure in Europe: What startups, SMEs, and research really need

Presentation on how design capabilities and infrastructure will secure Europe’s competitiveness. Participants learn to identify opportunities and potential collaborations with startups and SMEs.
Type: Strategic spotlight
Start: 13:30
End: 14:30
Location:
Club II

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Partner Session

Dutch Innovations: Driving European Collaboration in Advanced Packaging & PIC

Specifically in the fields of Photonic Integrated Circuits (PIC) design and manufacturing, Advanced Packaging and Heterogeneous Integration, the Netherlands are working on revolutionary semiconductor and PIC packaging technologies that will enable higher performance, better testing and metrology, greater scalability, and economically viable manufacturing in Europe. This session highlights key initiatives, including the ChipNL Competence Centre and the PIXEurope Pilot Line by the PITC, alongside the latest developments in Dutch research and industry. Together, these efforts demonstrate how collaboration across the European ecosystem is vital for accelerating innovation and strengthening Europe's position in semiconductors and integrated photonics. The session concludes with an interactive Q&A.
Type: Workshop
Start: 13:30
End: 14:30
Location:
Club III

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14:30 - 15:00
Break & Coffee

Networking coffee & exhibition

Time for exchange and informal discussions alongside the exhibition.
Type: Networking
Start: 14:30
End: 15:00
Location:
Lobby & Base

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15:00 - 16:00
Closing Panel Discussion

Beyond technology: Talent, skills, and sustainable workforce models for semiconductor excellence

Strategic discussion on talent, skills, and sustainable workforce models for European semiconductor excellence.
Type: Panel discussion
Start: 15:00
End: 16:00
Location:
Main Stage

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Innovation Deep Dive 1

Quasimonolithic integration: The ultimate device integration concept

Showcase of cutting-edge device integration technologies. Participants gain insights into disruptive product potential and strategic roadmaps.
Type: Deep dive
Start: 15:00
End: 16:00
Location:
Club I

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Innovation Deep Dive 2

STCO: Accelerating innovation from chiplet design to scalable production in Europe

Practical insights on how to scale chiplet design into European production. Focus on faster time-to-market and strategies to gain competitive advantages.
Type: Deep dive
Start: 15:00
End: 16:00
Location:
Club II

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Workshop

APECS Cleanroom Managers Workshop [invitation only]

The workshop brings together cleanroom managers and European partners involved in advanced process infrastructure. The goal is to provide a comprehensive overview of European pilot line cleanroom facilities, foster strategic exchange among partners and jointly identify measures to reduce barriers to cooperation and material exchange.
Type: Workshop
Start: 15:00
End: 16:30
Location:
Club III

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EUREF-CAMPUS BERLIN | GASOMETER

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